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High-Density Interconnect (HDI) PCBs use laser-drilled micro-vias — as small as 0.05 mm — to connect layers at far higher density than conventional through-hole vias. Superb Automation manufactures HDI boards up to 30-layer ELIC (Every Layer Intercon
6-layer ultra-thin HDI camera board by Superb Automation. 0.6mm finished thickness, 3/3mil trace/space, 4mil laser blind vias, ENIG finish, FR4 Tg≥150°C substrate. Optimized for MIPI D-PHY/C-PHY at 2.5Gbps/lane with